Gothenburg, May 29, 2024: Gapwaves has been granted funding from Vinnova for a project to develop an innovative, cost-effective, and high-performing packaged front-end chip to enable 6G wireless infrastructure at higher frequencies (140 GHz). The project will be conducted by a consortium in which Gapwaves collaborates with Gotmic AB over a period of 2 years. The total grant amount is MSEK 4, shared between the two companies.
Gapwaves R&D Director, Nils Dagås, comments: “We are very pleased that Vinnova has chosen to approve our project. The funding means that we can explore the usage of our proprietary gapwaveguide technology in semiconductor packaging to create a low-loss interface to mm-wave chips. We are happy to collaborate with Gotmic, combining our expertise in active and passive mm-wave technologies".
