Gothenburg, 6 October 2026: Gapwaves today presents a new waveguide packaging for high-power amplifiers (HPA), developed for Gotmic, a Swedish supplier of millimeter-wave MMICs and modules for 70–110 Ghz. The waveguide packaging enables smaller, lighter HPA modules that deliver more output power when used in radar, telecom and satellite systems. The waveguide packaging empowers Gotmic's new W-band amplifier PowerBlade™. This product will be shown for the first time at European Microwave Week (EuMW) 2026 in London this week.
As radar, telecom and satellite systems move to higher frequencies, power amplification becomes harder and more expensive. Every transition means signal loss and high-power amplifier chips also generate heat that must be removed to maintain output power. In size- and weight-constrained platforms such as unmanned aerial vehicles (UAV) and satellite links, the packaging is therefore a critical part of the system.
Gapwaves supplies the waveguide structure in copper for low loss and efficient heat spreading. Gotmic integrates its amplifier MMICs into this structure, connects them directly to the waveguide and is responsible for the complete module. The result is a thin, compact module that enables high-power performance in size- and weight-constrained platforms.
Gotmic's PowerBlade delivers 2W of output power in the W-band (around 92–100 GHz) and is designed for airborne, UAV and tactical radar.
Beyond defense applications, the packaging technology can be applied to HPA modules in telecom backhaul links, future 6G networks and satellite communication, where low weight and efficient heat dissipation are critical.
The waveguide packaging is based on Gapwaves' patented Multi-Layer Waveguide (MLW) technology, in which the waveguide structure is built from precision-etched metal layers. This allows both high performance with low-loss waveguide integration in a cost-efficient and compact form factor that is suited for industrial volume production.
"PowerBlade is for customers who need more output power than a single chip can deliver, without the size and weight of conventional power combining. Gapwaves' MLW technology gave us a low-loss, thermally efficient package for the first PowerBlade," says Magnus Elovsson, CEO of Gotmic.
"Our new waveguide packaging demonstrates the broad range of applications for MLW technology. In high-power amplifiers, heat dissipation is crucial. By using MLW, we achieve both low losses and excellent thermal capabilities. Other important requirements are weight and size, and with our technology this product can be provided in a very compact module. It is a great example of what our technology can do beyond automotive and represents a significant commercial opportunity for Gapwaves” says Nils Dagås, VP Product, Gapwaves.
Gapwaves and Gotmic at EuMW
Visitors can see Gapwaves' waveguide packaging and Gotmic's PowerBlade at European Microwave Week in London, October 6–8, where Gapwaves and Gotmic are exhibiting together at booth K66.
Abbas Vosoogh, CTO of Gapwaves and inventor of MLW, will give a presentation at the Automotive Forum on October 6 at 14:10, titled "Waveguide-Based Antenna-in-Package Solutions Using MLW for In-Cabin Radar Applications".
Nils Dagås, VP Product at Gapwaves, will take part as a panelist in the MTT-S Inter-Society technical panel discussion at EuMC titled "Dual-use technologies: Myth or high impact?" on October 6 at 16:50. He will also present at the Defense Forum on Wednesday, October 7th at 12:20.
To learn more or book a meeting, please contact sales@gapwaves.com.
